TSMC Solidifies Taiwan's Semiconductor Leadership with Major 2nm Chip Expansion

Taiwan's Tech Giant to Unveil Expansion Strategy, Reinforcing Commitment to Domestic Production

Taiwan Semiconductor Manufacturing Co. (TSMC), the world's leading contract chipmaker, is set to hold a significant ceremony on March 31st to unveil a major capacity expansion plan for its cutting-edge 2-nanometer (2nm) chips in Kaohsiung. This move underscores TSMC's unwavering dedication to continued investment and technological advancement within Taiwan, solidifying its position as a global semiconductor powerhouse.

The event, led by TSMC's co-chief operating officer, Y.P. Chyn, will provide further details next week regarding the expansion strategy. The announcement serves as a strong counterpoint to recent news of significant US investments. Earlier this month, TSMC announced an additional $100 billion investment in the United States for three new advanced chip manufacturing fabs, two advanced packaging plants, and a research and development center. Coupled with a previously announced $65 billion investment in its Arizona fabs, TSMC's total planned US investment reaches $165 billion.

This latest strategic move is widely interpreted as a clear signal that TSMC's core technology and production remain firmly rooted in Taiwan. TSMC CEO, C.C. Wei, has reiterated plans to build 11 production lines this year, emphasizing the company's commitment to retaining its core technological capabilities domestically.

TSMC is on schedule to initiate mass production of its first 2nm chips in the second half of this year at a fab in Hsinchu, putting it ahead of its global competitors. The 2nm technology is set to be the most advanced foundry technology available when it enters volume production. The planned expansion in Kaohsiung involves the construction of five fabs dedicated to gradually increasing 2nm chip capacity, ensuring Taiwan's continued dominance in the global semiconductor landscape.